x64 | File Size: 268 MB
CST Studio Suite 2019 builds on industry-leading simulation technology with a range of new features for the design, simulation and optimization of components and systems. New features include encrypted data sharing, the next generation of Perfect Boundary Approximation (PBA), full integration of the voxel body model poser, and the hybrid solver for bidirectional hybrid coupling between all the general purpose high-frequency solvers.
The 2019 release is also available on the Dassault Systèmes 3DEXPERIENCE platform, allowing direct links to other design and simulation tools.
These tools increase the agility of CST Studio Suite for modeling and simulating complex systems, and allow electromagnetic simulation to be applied in large projects spanning multiple departments and suppliers.
Facilities and software features of CST STUDIO SUITE:
-Local graphical user interface based on Windows
-Multiple interface between documents
-Tools variables, parameters and the message window
-(OLE) Linking and Embedding Automation Server (COM / DCOM)
-Transfer Parameters
-Automatic Optimization
-Animation Layout
-Automatic creation of power point slides
-Project Management
-Ability to switch between different software components, including:
-CST DESIGN STUDIO (CST DS), CST MICROWAVE STUDIO (CST MWS), CST EM STUDIO (CST EMS),
-CST PARTICLE STUDIO (CST PS), CST MPHYSICS STUDIO (CST MPS), CST PCB STUDIO (CST PCBS), CST CABLE STUDIO (CST CS)
Components include a CST STUDIO SUITE:
-CST MICROWAVE STUDIO - CST MWS: edge tools for speed and accuracy leading up to the three-dimensional simulation of high-frequency devices.
-CST EM STUDIO - CST EMS: simple tools for design and analysis of static and low-frequency devices such as motors, sensors, transformers and ...
-CST PARTICLE STUDIO - CST PS: to simulate the motion of charged particles, all based or otherwise. This includes the electron gun, cathode ray tubes and tools from the hand.
-CST CSBLE STUDIO - CST CS: to simulate the entire signal detection and analysis of electromagnetic compatibility or incompatibility of cable glands.
-CST PCB STUDIO - CST PCBS: to simulate the sound signal and detect electromagnetic compatibility or incompatibility of the printed circuit board.
-CST MPHYSCIS STUDIO - CST MPS: to analyze the thermal and mechanical stress.
-CST DESIGN STUDIO - CST DS: The tool is versatile and combines circuit simulation to electromagnetic helps
System Requirements:
Minimum requirement:
CPU:Intel x86-64processor
Memory:16GB RAM
GPU:100% OpenGL compatible graphics card
Storage:30GB of free disk space
High end server/ workstation recommendation:
CPU
ual Intel Xeon Scalable (also known as "Skylake" ) processorMemory:32- 64 GB per CPU
GPU:NVIDIA Quadro series card dedicated to CAD/CAE applications
Storage:At least 500GB hard disk drive/SSDs may be used, but are not necessary for good simulation performance
WHATS NEW:
What's New in this Version:
General:
-Encryption of CST models for securely sharing data (IP protection) - T-FIT Solver only
-CST POWER'BY: Connection of CST STUDIO SUITE to 3DEXPERIENCE platform
-New Schematic Editor with strongly improved performance and usability
-Improved Poser tool to posture human voxel models
-SAM Array Task allows post-processing optimization in full array
-New Anchorpoint Sweep in Assembly Viewer
Meshing:
-TET: Option for automatic edge refinement for z-planar structures
-HEX: Next generation PBA now default for newly created models (more robust connectivity handling, even for extremely complex CAD models)
Post-Processing:
-HDF5 binary export for 2D/3D results, ray plots, field lines, trajectories and particles
-Multilayer Farfield calculation now supports dispersive materials
-Farfield Export Result Templates support parametric storage
-Interactive evaluation of selected result templates for all existing parametric results
-Real and imaginary part of a 1D complex curve can be visualized in a single plot
-Parameter Sweep - Template Based Post-Processing now possible in 3D
3D EM Technology:
High Frequency Simulation:
-Support of new GPU devices: NVIDIA Tesla V100 and Quadro GV100
-Improved HPC Cluster check for MPI simulations
-Distributed Computing - Merge time improved
-Lumped Elements Touchstone Circuits (T,F)
-Simultaneous Excitation (F,I)
-Windscreen antenna simulations: Improved setup (I)
-FD, TLM and Asymptotic Solver now included in Hybrid Solver (F, TLM, A)
Low Frequency Simulation:
-3D rotational motion (LT)
-Support of periodic subvolumes in 3D (LT + Mstatic)
-SAM Machine Task with several improvements
Particle Simulation:
-New solver E-Static PIC Solver (for slow movements, e.g. plasma)
-Optically induced emission model (photoemission)
-Combined E-field plots with particles
Cable / Circuit / PCB / Chip:
Cable Simulation:
-Simplified definition of cable bundles in 3D
-Easy definition of junctions between cable terminals
-Stranded wires in TLM Solver (bi-directional coupling with cables thicker than a mesh cell)
-Improved accuracy of lossy metals, used in cable cross section
-Parameter sweep for random bundling
-Running Cable Simulations on Linux OS (batch mode only)
Circuit Simulation:
-New Schematic Editor with improved performance and usability
-Excitation Settings now available in Task Parameter list
-New IBIS AMI Task
Filter Designer:
-FD2D: improved accuracy of fast distributed models
-FD3D: VNA based filter tuning (coupling matrix extraction from real-time measured S-parameters)
-FD3D - New topologies for dual- and multi-mode filters
Interference Task:
-Interactive violation matrix, directly opening EMI margin plot
-Radio library available for support page
EDA Import and PCB Simulation:
-IR and PI Result Field now use normal layout window with all selection capabilities
-2DTL and SI coupling limits can be determined from threshold voltage
-IR Drop with detailed power loss and sign off reporting
Boardcheck:
-Electrical data for rules is calculated from PCB data
-Hierarchical violation view
Chip Interface:
-Cadence-Virtuoso plug-in
-Import from interconnect technology files (*.ict, *.itf)
-Button for easy 3D-model generation
Multi-Physics:
Thermal Simulation:
-Support for automatic PCB thermal model simplification (CHT)
-Support for the JEDEC two-resistor thermal compact model with contact properties (CHT)
-More accurate face-based contact properties (CHT)
HOMEPAGE
Код:
https://www.cst.com/
Код:
http://nitroflare.com/view/5E79ED99E40F84F/mr06n.CST.STUDIO.SUITE.2019.0.3.SP3.x64.Update.Only.rar
Код:
https://rapidgator.net/file/05bf5c6c470db9eb57545558acd2b83f/mr06n.CST.STUDIO.SUITE.2019.0.3.SP3.x64.Update.Only.rar
Код:
http://uploaded.net/file/abrhsuo8/mr06n.CST.STUDIO.SUITE.2019.0.3.SP3.x64.Update.Only.rar